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Semiconductors (integrated circuits/chips) :
Wafer manufacturing : High-purity reagents such as sulfuric acid and hydrogen peroxide are used for cleaning and etching, while high-purity gases are used for processes such as thin film deposition and ion implantation.
Packaging : Electronic adhesives and solders are crucial in chip packaging.
Flat panel displays (LCD/OLED) :
Panel manufacturing : Wet chemicals such as stripping solution, etching solution, and developing solution are used in the precision processing of TFT-LCD and OLED panels.
Printed circuit board (PCB) :
Electroplating chemicals, acids and corrosives, and specialty gases are used for the formation and protection of circuits.
New energy/photovoltaics :
Potassium hydroxide and other substances are used in the wet process of solar cell manufacturing.
Wet electronic chemicals : high-purity acids, alkalis, and solvents (such as sulfuric acid, nitric acid, isopropanol, etc.).
Specialty gases : such as nitrogen, argon, ammonia, silane, etc., are used for cavity environments, etching, and doping.
Photoresist and related reagents : core materials that determine the precision of chip circuitry.
Encapsulation materials : epoxy resin, conductive silver paste, etc., to protect and connect the chip.
Electronic adhesives /additives : Improve product performance and reliability.
High purity : Extremely high requirements, even trace impurities can cause product failure.
Variety and rapid updates : With continuous technological advancements and iterations, the requirements for material performance are becoming increasingly stringent.
The industrial chain foundation is the underlying support for the electronic information industry, from "materials" to "devices" to "complete machines".